Surface modulation to enhance chemical mechanical polishing performance of sliced silicon carbide Si-face

Highly efficient and damage-free polishing of GaN (0 0 0 1) by electrochemical etching-enhanced CMP process

(2020) Linfeng Zhang et al.   APPLIED SURFACE SCIENCE

Highly efficient planarization of sliced 4H–SiC (0001) wafer by slurryless electrochemical mechanical polishing

(2019) Xu Yang et al.   INTERNATIONAL JOURNAL OF MACHINE TOOLS & MANUFACTURE

Atomic-scale finishing of carbon face of single crystal SiC by combination of thermal oxidation pretreatment and slurry polishing

(2018) Hui Deng et al.   APPLIED SURFACE SCIENCE

Micromachining of 4H-SiC using femtosecond laser

(2018) Ru Zhang et al.   CERAMICS INTERNATIONAL

Damage-free highly efficient polishing of single-crystal diamond wafer by plasma-assisted polishing

(2018) K. Yamamura et al.   CIRP ANNALS-MANUFACTURING TECHNOLOGY

The influence of concentration of hydroxyl radical on the chemical mechanical polishing of SiC wafer based on the Fenton reaction

(2018) Jiabin Lu et al.   PRECISION ENGINEERING-JOURNAL OF THE INTERNATIONAL SOCIETIES FOR PRECISION ENGINEERING AND NANOTECHNOLOGY

Preparation of a novel catalyst (SoFe III ) and its catalytic performance towards the removal rate of sapphire substrate during CMP process

(2018) Li Xu et al.   TRIBOLOGY INTERNATIONAL

SEM, AFM and TEM Studies for Repeated Irradiation Effect of Femtosecond Laser on 4H-SiC Surface Morphology at Near Threshold Fluence

(2018) Chengwu Wang et al.   ECS Journal of Solid State Science and Technology

Low-Cost Fabrication of Large-Area Broccoli-Like Multiscale Micro- and Nanostructures for Metallic Super-Hydrophobic Surfaces with Ultralow Water Adhesion and Superior Anti-Frost Ability

(2018) Jiangyou Long et al.   Advanced Materials Interfaces

Hierarchical micro- and nanostructures induced by nanosecond laser on copper for superhydrophobicity, ultralow water adhesion and frost resistance

(2018) Jiangyou Long et al.   MATERIALS & DESIGN

Nano Periodic Structure Formation in 4H–SiC Crystal Using Femtosecond Laser Double-Pulses

(2018) E. Kim et al.   Journal of Superhard Materials

Formation mechanism of hierarchical Micro- and nanostructures on copper induced by low-cost nanosecond lasers

(2018) Jiangyou Long et al.   APPLIED SURFACE SCIENCE

Improvement in polishing effect of silicon wafer due to low-amplitude megasonic vibration assisting chemical-mechanical polishing

(2018) Liang Li et al.   JOURNAL OF MATERIALS PROCESSING TECHNOLOGY

Reliable evaluation of fracture toughness in ceramics via nanosecond laser notching method

(2018) Anzhe Wang et al.   JOURNAL OF THE EUROPEAN CERAMIC SOCIETY

Damage-free finishing of CVD-SiC by a combination of dry plasma etching and plasma-assisted polishing

(2017) Hui Deng et al.   INTERNATIONAL JOURNAL OF MACHINE TOOLS & MANUFACTURE

UV-TiO2 photocatalysis-assisted chemical mechanical polishing 4H-SiC wafer

(2017) Zewei Yuan et al.   MATERIALS AND MANUFACTURING PROCESSES

Surface Morphology Evolution Induced by Multiple Femtosecond Laser Ablation on 4H-SiC Substrate and Its Application to CMP

(2017) Chengwu Wang et al.   ECS Journal of Solid State Science and Technology

Effects of ultra-smooth surface atomic step morphology on chemical mechanical polishing (CMP) performances of sapphire and SiC wafers

(2015) Yan Zhou et al.   TRIBOLOGY INTERNATIONAL

Comparison of thermal oxidation and plasma oxidation of 4H-SiC (0001) for surface flattening

(2014) Hui Deng et al.   APPLIED PHYSICS LETTERS

Chemical mechanical planarization (CMP) of on-axis Si-face SiC wafer using catalyst nanoparticles in slurry

(2014) Yan Zhou et al.   SURFACE & COATINGS TECHNOLOGY

Ultrafast lasers—reliable tools for advanced materials processing

(2014) Koji Sugioka et al.   Light-Science & Applications

Chemical mechanical polishing (CMP) of on-axis Si-face 6H-SiC wafer for obtaining atomically flat defect-free surface

(2013) Guoshun Pan et al.   JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS

Plasma assisted polishing of single crystal SiC for obtaining atomically flat strain-free surface

(2011) K. Yamamura et al.   CIRP ANNALS-MANUFACTURING TECHNOLOGY