Molecular Dynamics Study of the Effect of Abrasive Grains Orientation and Spacing during Nanogrinding

Stress Distribution in Silicon Subjected to Atomic Scale Grinding with a Curved Tool Path

(2020) Xudong Fang et al.   Materials

Influence of the Rake Angle on Nanocutting of Fe Single Crystals: A Molecular-Dynamics Study

(2020) Iyad Alabd Alhafez et al.   Crystals

Investigation of tool geometry in nanoscale cutting single-crystal copper by molecular dynamics simulation

(2019) Houfu Dai et al.   PROCEEDINGS OF THE INSTITUTION OF MECHANICAL ENGINEERS PART J-JOURNAL OF ENGINEERING TRIBOLOGY

Study of subsurface damage of monocrystalline nickel in nanometric grinding with spherical abrasive grain

(2019) Jie Ren et al.   PHYSICA B-CONDENSED MATTER

Subsurface damage and material removal of Al–Si bilayers under high-speed grinding using molecular dynamics (MD) simulation

(2019) Qiong Wang et al.   APPLIED PHYSICS A-MATERIALS SCIENCE & PROCESSING

Study on subsurface damage of wafer silicon containing through silicon via in thinning

(2019) Yixin Xu et al.   European Physical Journal Plus

Effect of different crystal orientations on the surface integrity during nanogrinding of monocrystalline nickel

(2019) Jie Ren et al.   MODELLING AND SIMULATION IN MATERIALS SCIENCE AND ENGINEERING

A molecular dynamic study of nano-grinding of a monocrystalline copper-silicon substrate

(2019) Yixin Xu et al.   APPLIED SURFACE SCIENCE

Molecular dynamics research on ultra-high-speed grinding mechanism of monocrystalline nickel

(2018) Jie Ren et al.   APPLIED SURFACE SCIENCE

Atomistic insights on the nanoscale single grain scratching mechanism of silicon carbide ceramic based on molecular dynamics simulation

(2018) Yao Liu et al.   AIP Advances

Mechanical properties of silicon in subsurface damage layer from nano-grinding studied by atomistic simulation

(2018) Zhiwei Zhang et al.   AIP Advances

Generation and distribution of residual stress during nano-grinding of monocrystalline silicon

(2018) Pei Chen et al.   JAPANESE JOURNAL OF APPLIED PHYSICS

Molecular Dynamics Modeling and Simulation of Diamond Cutting of Cerium

(2017) Junjie Zhang et al.   Nanoscale Research Letters

Mechanisms of subsurface damage and material removal during high speed grinding processes in Ni/Cu multilayers using a molecular dynamics study

(2017) QiHong Fang et al.   RSC Advances

Molecular Dynamics Modeling and Simulation of Diamond Cutting of Cerium

(2017) Junjie Zhang et al.   Nanoscale Research Letters

The effect of tool geometry on subsurface damage and material removal in nanometric cutting single-crystal silicon by a molecular dynamics simulation

(2016) Houfu Dai et al.   APPLIED PHYSICS A-MATERIALS SCIENCE & PROCESSING

Molecular dynamics study on the thickness of damage layer in multiple grinding of monocrystalline silicon

(2016) Xiaoguang Guo et al.   MATERIALS SCIENCE IN SEMICONDUCTOR PROCESSING

Rolling Resistance and Mechanical Properties of Grinded Copper Surfaces Using Molecular Dynamics Simulation

(2016) Shih-Wei Liang et al.   Nanoscale Research Letters

Rolling Resistance and Mechanical Properties of Grinded Copper Surfaces Using Molecular Dynamics Simulation

(2016) Shih-Wei Liang et al.   Nanoscale Research Letters

Nano-machining of materials: understanding the process through molecular dynamics simulation

(2016) Dan-Dan Cui et al.   Advances in Manufacturing

Evolution of topography and material removal during nanoscale grinding

(2015) S J Eder et al.   JOURNAL OF PHYSICS D-APPLIED PHYSICS

Nanotribological simulations of multi-grit polishing and grinding

(2015) S.J. Eder et al.   WEAR

A molecular dynamics investigation into the mechanisms of subsurface damage and material removal of monocrystalline copper subjected to nanoscale high speed grinding

(2014) Jia Li et al.   APPLIED SURFACE SCIENCE

An analysis method for atomistic abrasion simulations featuring rough surfaces and multiple abrasive particles

(2014) S.J. Eder et al.   COMPUTER PHYSICS COMMUNICATIONS

The current understanding on the diamond machining of silicon carbide

(2014) Saurav Goel   JOURNAL OF PHYSICS D-APPLIED PHYSICS

An atomistic investigation on the mechanism of machining nanostructures when using single tip and multi-tip diamond tools

(2013) Zhen Tong et al.   APPLIED SURFACE SCIENCE

A numeric investigation of friction behaviors along tool/chip interface in nanometric machining of a single crystal copper structure

(2013) Chunhui Ji et al.   INTERNATIONAL JOURNAL OF ADVANCED MANUFACTURING TECHNOLOGY

Nano-scale machining of polycrystalline coppers - effects of grain size and machining parameters

(2013) Jing Shi et al.   Nanoscale Research Letters

Study on critical rake angle in nanometric cutting

(2012) M. Lai et al.   APPLIED PHYSICS A-MATERIALS SCIENCE & PROCESSING

MOLECULAR DYNAMICS SIMULATION OF NANOMETRIC CUTTING

(2010) Rapeepan Promyoo et al.   MACHINING SCIENCE AND TECHNOLOGY