Subsurface damage and material removal of Al–Si bilayers under high-speed grinding using molecular dynamics (MD) simulation
出版年份 2019 全文链接
标题
Subsurface damage and material removal of Al–Si bilayers under high-speed grinding using molecular dynamics (MD) simulation
作者
关键词
-
出版物
APPLIED PHYSICS A-MATERIALS SCIENCE & PROCESSING
Volume 125, Issue 8, Pages -
出版商
Springer Science and Business Media LLC
发表日期
2019-07-17
DOI
10.1007/s00339-019-2778-3
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