Effect of Conditioner Type and Downforce, and Pad Surface Micro-Texture on SiO2 Chemical Mechanical Planarization Performance

Effect of Conditioning Downforce and Pad Break-In Time on Pad Surface Micro-Texture

(2018) Jeffrey McAllister et al.   ECS Journal of Solid State Science and Technology

Effect of Pad Surface Micro-Texture on Removal Rate during Interlayer Dielectric Chemical Mechanical Planarization Process

(2013) Xiaoyan Liao et al.   JAPANESE JOURNAL OF APPLIED PHYSICS

Pad roughness evolution during break-in and its abrasion due to the pad-wafer contact in oxide CMP

(2013) Boris Vasilev et al.   MICROELECTRONIC ENGINEERING

Investigating Effect of Conditioner Aggressiveness on Removal Rate during Interlayer Dielectric Chemical Mechanical Planarization through Confocal Microscopy and Dual Emission Ultraviolet-Enhanced Fluorescence Imaging

(2010) Ting Sun et al.   JAPANESE JOURNAL OF APPLIED PHYSICS

Optical and Mechanical Characterization of Chemical Mechanical Planarization Pad Surfaces

(2010) Ting Sun et al.   JAPANESE JOURNAL OF APPLIED PHYSICS

Investigating the effect of diamond size and conditioning force on chemical mechanical planarization pad topography

(2009) T. Sun et al.   MICROELECTRONIC ENGINEERING