Effect of Conditioning Downforce and Pad Break-In Time on Pad Surface Micro-Texture

Effect of CVD-Coated Diamond Discs on Pad Surface Micro-Texture and Polish Performance in Copper CMP

(2018) Calliandra Stuffle et al.   ECS Journal of Solid State Science and Technology

Effect of Pad Surface Micro-Texture on Tribological, Thermal and Kinetic Characterizations during Copper Chemical Mechanical Planarization

(2017) Ruochen Han et al.   ECS Journal of Solid State Science and Technology

Effect of Pad Surface Micro-Texture on Removal Rate during Tungsten Chemical Mechanical Planarization

(2016) Yan Mu et al.   ECS Journal of Solid State Science and Technology

Effect of Pad Surface Micro-Texture on Removal Rate during Interlayer Dielectric Chemical Mechanical Planarization Process

(2013) Xiaoyan Liao et al.   JAPANESE JOURNAL OF APPLIED PHYSICS

Pad roughness evolution during break-in and its abrasion due to the pad-wafer contact in oxide CMP

(2013) Boris Vasilev et al.   MICROELECTRONIC ENGINEERING

An Approach for Correlating Friction Force and Removal Rate to Pad Topography during Tungsten Chemical Mechanical Planarization

(2011) Yasa Sampurno et al.   ELECTROCHEMICAL AND SOLID STATE LETTERS

Investigating Effect of Conditioner Aggressiveness on Removal Rate during Interlayer Dielectric Chemical Mechanical Planarization through Confocal Microscopy and Dual Emission Ultraviolet-Enhanced Fluorescence Imaging

(2010) Ting Sun et al.   JAPANESE JOURNAL OF APPLIED PHYSICS

Optical and Mechanical Characterization of Chemical Mechanical Planarization Pad Surfaces

(2010) Ting Sun et al.   JAPANESE JOURNAL OF APPLIED PHYSICS

Investigating the effect of diamond size and conditioning force on chemical mechanical planarization pad topography

(2009) T. Sun et al.   MICROELECTRONIC ENGINEERING