Pad roughness evolution during break-in and its abrasion due to the pad-wafer contact in oxide CMP

标题
Pad roughness evolution during break-in and its abrasion due to the pad-wafer contact in oxide CMP
作者
关键词
-
出版物
MICROELECTRONIC ENGINEERING
Volume 111, Issue -, Pages 21-28
出版商
Elsevier BV
发表日期
2013-05-09
DOI
10.1016/j.mee.2013.04.027

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