Fracture analysis in piezoelectric semiconductors under a thermal load

Published 2014 View Full Article

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Title
Fracture analysis in piezoelectric semiconductors under a thermal load
Authors
Keywords
-
Journal
ENGINEERING FRACTURE MECHANICS
Volume 126, Issue -, Pages 27-39
Publisher
Elsevier BV
Online
2014-06-07
DOI
10.1016/j.engfracmech.2014.05.011

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