Journal
ELECTROCHIMICA ACTA
Volume 58, Issue -, Pages 599-605Publisher
PERGAMON-ELSEVIER SCIENCE LTD
DOI: 10.1016/j.electacta.2011.10.004
Keywords
Copper monosulfide; ECALE; ECALD; Electrodeposition; Ag(111)
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Funding
- MIUR (Italy) [2008N7CYL5]
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Copper sulfide (CuS) thin films were grown on a single crystal Ag(111) substrate by Electrochemical Atomic Layer Deposition (ECALD) method, i.e., by alternated surface limited deposition of copper and sulfur. A detailed investigation of deposition of Cu on S allowed to find the best conditions for copper deposition. The electrochemical characterization of deposits obtained with different deposition cycles suggests a 1:1 stoichiometric ratio between Cu and S corresponding to Cu monosulfide. The compositional analysis was performed by X-rays Photoelectron Spectroscopy (XPS), and the morphological was investigated by Atomic Force Microscopy (AFM) for deposits formed with 20 ECALD cycles. (C) 2011 Elsevier Ltd. All rights reserved.
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