Bottom-Up Filling in Electroless Plating with an Addition of PEG-PPG Triblock Copolymers

In this article, a bottom-up copper filling for different submicrometer trenches was investigated by an electroless deposition technique using a triblock copolymer of poly(ethylene glycol) (PEG)-Cpoly(propylene glycol) (PPG)-CPEG with ethylene oxide terminal blocks as an additive. The bottom-up filling behavior of the electroless copper bath for different trenches was investigated in a plating bath containing 1.0 mg/L EPE-8000. The cross-sectional scanning electron microscopy observation indicated that the trenches with different widths ranging from 110 to 640 nm were all filled completely by electroless copper. The inhibitions of EPE-8000 for both cathodic and anodic reactions were studied. (C) 2010 The Electrochemical Society. [DOI: 10.1149/1.3388488] All rights reserved.