Mechanical effects of polishing pad in copper electrochemical mechanical deposition for planarization

Published 2009 View Full Article

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Title
Mechanical effects of polishing pad in copper electrochemical mechanical deposition for planarization
Authors
Keywords
-
Journal
CURRENT APPLIED PHYSICS
Volume 10, Issue 1, Pages 299-304
Publisher
Elsevier BV
Online
2009-06-17
DOI
10.1016/j.cap.2009.06.011

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