Modeling and experimental verification of thermally induced residual stress in RF-MEMS

Published 2015 View Full Article

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Title
Modeling and experimental verification of thermally induced residual stress in RF-MEMS
Authors
Keywords
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Journal
JOURNAL OF MICROMECHANICS AND MICROENGINEERING
Volume 25, Issue 5, Pages 055007
Publisher
IOP Publishing
Online
2015-04-07
DOI
10.1088/0960-1317/25/5/055007

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