Flip-chip integration of Si bare dies on polymeric substrates at low temperature using ICA vias made in dry film photoresist

Published 2015 View Full Article

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Title
Flip-chip integration of Si bare dies on polymeric substrates at low temperature using ICA vias made in dry film photoresist
Authors
Keywords
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Journal
JOURNAL OF MICROMECHANICS AND MICROENGINEERING
Volume 25, Issue 4, Pages 045013
Publisher
IOP Publishing
Online
2015-03-24
DOI
10.1088/0960-1317/25/4/045013

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