Development of a large-area chip network with multidevice integration using a stretchable electroplated copper spring

Published 2015 View Full Article

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Title
Development of a large-area chip network with multidevice integration using a stretchable electroplated copper spring
Authors
Keywords
-
Journal
JOURNAL OF MICROMECHANICS AND MICROENGINEERING
Volume 26, Issue 2, Pages 025003
Publisher
IOP Publishing
Online
2015-12-18
DOI
10.1088/0960-1317/26/2/025003

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