Crack propagation behaviors at Cu/SiC interface by molecular dynamics simulation

Title
Crack propagation behaviors at Cu/SiC interface by molecular dynamics simulation
Authors
Keywords
-
Journal
COMPUTATIONAL MATERIALS SCIENCE
Volume 82, Issue -, Pages 17-25
Publisher
Elsevier BV
Online
2013-10-11
DOI
10.1016/j.commatsci.2013.09.029

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