Journal
JOURNAL OF MATERIALS SCIENCE
Volume 50, Issue 10, Pages 3706-3715Publisher
SPRINGER
DOI: 10.1007/s10853-015-8931-2
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Funding
- U.S. Department of Energy (DOE), Office of Science, Basic Energy Sciences (BES) [FWP 12-013170]
- US Department of Energy [DEAC04-94AL85000]
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The metal tantalum has many varied uses including in microelectronics (especially in capacitors) as thin films, in medical applications as an implant material or for surgical instruments, in X-ray lithography for masks, and in high-temperature structural applications. Ta is particularly useful because it is relatively ductile, refractory in nature, and does not readily react with corrosive materials. The body-centered cubic (bcc) crystal structure of pure Ta, also known as the alpha-phase, is the most commonly observed, but Ta is also known to exist in two other allotropes, one tetragonal and the other (much less-well-known) face-centered cubic (fcc). The tetragonal form (beta-Ta) has been produced by various deposition techniques and often occurs mixed with the alpha-phase; the fcc phase has only previously been reported in thin films deposited by thermal evaporation. There have been other reports of 'bcc metals' such as V and Fe existing with an fcc crystal structure when the metal is deposited as a thin film. In the present study, fcc Ta with a = 0.43 nm has been observed using transmission electron microscopy in bulk samples of Ta that have been subjected to quasi-static tensile deformation that was so large as to cause fracture of the material. The fcc phase has a relatively small grain size but appears to be stable at room temperature. It is also shown that relatively large grains (10-20 nm in diameter) of Ta can also exist with an hcp structure with a = 0.304 nm and c = 0.494 nm.
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