Optical and Electronic Packaging Processes for Silicon Photonic Systems

Published 2015 View Full Article

  1. Home
  2. Publications
  3. Publication Search
  4. Publication Details
Title
Optical and Electronic Packaging Processes for Silicon Photonic Systems
Authors
Keywords
-
Journal
JOURNAL OF LIGHTWAVE TECHNOLOGY
Volume 33, Issue 5, Pages 991-997
Publisher
Institute of Electrical and Electronics Engineers (IEEE)
Online
2015-02-17
DOI
10.1109/jlt.2015.2390675

Ask authors/readers for more resources

Protocol

Community support

Reagent

Community support

Reprint

Contact the author

Discover Peeref hubs

Discuss science. Find collaborators. Network.

Join a conversation

Create your own webinar

Interested in hosting your own webinar? Check the schedule and propose your idea to the Peeref Content Team.

Create Now
Webinars Posters Questions Hubs Funding Journals Articles Connect Collections Reviewers About Us FAQs Mobile App Privacy Policy Terms of Use
© Peeref 2019-2024. All rights reserved.