Article
Engineering, Manufacturing
Min Li, Minghui Liu, Oltmann Riemer, Bernhard Karpuschewski, Cheng Tang
Summary: The ST-CP approach combines shear thickening and chemical-physical friction mechanisms for efficient polishing, with a mathematical model to control material removal rate.
INTERNATIONAL JOURNAL OF MACHINE TOOLS & MANUFACTURE
(2021)
Article
Engineering, Mechanical
Jiahui Li, Weihao Ma, Xi Hou, Yun Zhang
Summary: This study presents an ultra-smooth surface polishing technology based on elastic material removal, and proposes a multiscale contact area analysis model to study the material removal process and predict the removal profile. The reliability of the model is verified through experiments, and the influence of experimental parameters on the material removal rate is explained.
INTERNATIONAL JOURNAL OF MECHANICAL SCIENCES
(2023)
Article
Automation & Control Systems
Xingtian Qu, Qinglong Liu, Hongyi Wang, Haizhong Liu, Jiming Liu, Huichao Sun
Summary: This paper combines polishing path planning and material removal optimization to ensure material removal uniformity and polishing efficiency. Two common polishing paths, the scanning path and the concentric circle path, are analyzed and optimized. Simulations and experiments confirm that the proposed method effectively improves material removal uniformity, controls material removal thickness, and ensures polishing efficiency.
INTERNATIONAL JOURNAL OF ADVANCED MANUFACTURING TECHNOLOGY
(2023)
Article
Chemistry, Physical
Hang Xiao, Yifan Dai, Jian Duan, Ye Tian, Jia Li
Summary: Ion beam polishing techniques are crucial in the manufacturing of optical elements, and atomic simulations have been used to investigate the effects of ion dose, surface roughness, and ion energy on surface quality. Optimizing parameters can lead to the preparation of high-precision, low-defect ion beam polishing samples for optics applications.
APPLIED SURFACE SCIENCE
(2021)
Article
Engineering, Mechanical
Weifeng Yao, Qingqing Chu, Binghai Lyu, Chengwu Wang, Qi Shao, Ming Feng, Zhe Wu
Summary: This paper investigates the material removal and surface roughness in cylindrical polishing using a soft pad and free abrasives. The study proposes models for material removal and surface roughness, taking into account the contact deformation at different scales. Experimental and simulation results verify the accuracy of the models. The influence of loading force, abrasives concentration, and grain size on material removal and surface roughness is analyzed, along with parameters related to contact under different conditions.
INTERNATIONAL JOURNAL OF MECHANICAL SCIENCES
(2022)
Article
Engineering, Manufacturing
Linfeng Zhang, Dong Lu, Hui Deng
Summary: Electrochemical etching can alter the carrier distribution along the polar plane and cause severe surface oxidation on the Ga-face. The etched surface morphology can be divided into protrusions and pits depending on excessive carrier density, and the pre-etched surface exhibits better ductility and desirable surface quality.
JOURNAL OF MANUFACTURING PROCESSES
(2022)
Article
Materials Science, Coatings & Films
Jiahuan Wang, Yu Zhou, Zhen Qiao, Saurav Goel, Jinhu Wang, Xu Wang, Hongyu Chen, Julong Yuan, Binghai Lyu
Summary: This study compared three newly developed polishing techniques, namely shear thickening polishing (STP), chemistry enhanced STP (C-STP), and electrolysis enhanced STP (E-STP). The results showed that C-STP produced a Beilby layer after polishing, resulting in improved mechanical and biological performance. C-STP had the lowest surface roughness and highest material removal rate (MRR) among the three techniques. E-STP showed intermittent improvements in surface roughness and MRR, and had the best wettability and corrosion resistance.
SURFACE & COATINGS TECHNOLOGY
(2023)
Article
Engineering, Mechanical
Tan-Tai Do, Te-Hua Fang
Summary: This study employed molecular dynamics simulations to investigate the substrate removal methods in beta-SiC polishing. The vibration-coupled rolling motion was found to be the most effective, while the sliding motion showed significant improvement in atom removal. Additionally, increasing the number of asperities and the amplitude of vibration led to improved surface roughness.
TRIBOLOGY INTERNATIONAL
(2023)
Article
Engineering, Mechanical
Nathan Fantecelle Strey, Cherlio Scandian
Summary: This study investigated the impact of different materials and polishing loads on the surface quality of ceramic tribological components. The results showed that silicon carbide had higher material removal rate and better surface finish, while alumina and zirconia-toughened alumina mainly relied on ductile mechanisms to improve surface quality.
Article
Chemistry, Physical
Wan Wang, Dongpeng Hua, Qing Zhou, Shuo Li, Stefan J. Eder, Junqin Shi, Zhijun Wang, Haifeng Wang, Weimin Liu
Summary: This work uses molecular dynamics simulation to reveal the chemical mechanical polishing (CMP) mechanism of the Invar alloy in water-lubricated environments. The results show that the appropriate thickness of the water film and polishing speed can reduce surface roughness and eliminate subsurface defects. Increasing rolling speed leads to a decrease in surface roughness and subsurface damage thickness, while increasing water film thickness results in more subsurface defects despite reducing surface roughness through an increase in passivated atoms. These findings contribute to understanding the CMP mechanism in water-lubricated conditions and promoting the development of surface engineering for micro/nano components.
APPLIED SURFACE SCIENCE
(2023)
Article
Chemistry, Physical
Hongfei Tao, Qinyang Zeng, Yuanhang Liu, Dewen Zhao, Xinchun Lu
Summary: This study systematically investigates the influence of ground surface topography on the material removal mechanism in the chemical mechanical polishing (CMP) process of ultra-thin silicon wafers. Through experiments and simulations, the contact characteristics between the wafer and polishing solution, the corrosion behaviors of the ground silicon wafer, and the influence of wafer surface topography on corrosion resistance are revealed. The study demonstrates the corrosion promotion principle of ground silicon wafer in the CMP process.
APPLIED SURFACE SCIENCE
(2023)
Article
Engineering, Mechanical
Max Schneckenburger, Rui Almeida, Sven Hoefler, Rainer Boerret
Summary: This paper investigates the issue of slurry erosion in glass polishing and discusses the influence of conventional polishing nozzles.
Article
Automation & Control Systems
Jianwei Ji, Muhammad Ajmal Khan, Zejin Zhan, Rong Yi, Hui Deng
Summary: In this paper, the universal factor determining the evolution of surface roughness during electrochemical polishing (ECP) is studied. The material removal thickness is found to be the key parameter governing the roughness evolution of the polished surface, regardless of other parameters.
INTERNATIONAL JOURNAL OF ADVANCED MANUFACTURING TECHNOLOGY
(2022)
Article
Engineering, Multidisciplinary
Anthony T. H. Beaucamp, Kotaro Nagai, Tomoko Hirayama, Mutsumi Okada, Hirofumi Suzuki, Yoshiharu Namba
Summary: Through computational fluid dynamics and molecular dynamics simulations, it is discovered that the material removal mechanism in float polishing relies on micron-sized fluid gaps and nano-abrasive agglomerates. The polishing effects include two smoothing phenomena: atomic removal and atomic transfer.
PRECISION ENGINEERING-JOURNAL OF THE INTERNATIONAL SOCIETIES FOR PRECISION ENGINEERING AND NANOTECHNOLOGY
(2022)
Article
Automation & Control Systems
Sheng Qu, Tao Yu, Fanwei Meng, Chao Zhang, Xuewei Zhang, Zhelun Ma, Zixuan Wang, Tianbiao Yu, Ji Zhao
Summary: Ultrasonic vibration polishing (UVP), integrating mechanical polishing and ultrasonic vibration technologies, is used for processing monocrystalline silicon. A predictive model for material removal rate (MRR) is developed, considering micro-level contact, scratch effect, and impact removal. UVP experiments validate the model, with MRR being consistent and controlled within 10% error rate. Increasing spindle speed and ultrasonic amplitude enhances kinetic energy, while larger abrasive grain size improves contact area, thus contributing to MRR. Additionally, different polishing parameters are analyzed for surface roughness and morphology.
INTERNATIONAL JOURNAL OF ADVANCED MANUFACTURING TECHNOLOGY
(2023)
Article
Engineering, Manufacturing
Weisi Li, Yancheng Wang, Valens Nteziyaremye, Hitomi Yamaguchi, Albert J. Shih
JOURNAL OF MANUFACTURING SCIENCE AND ENGINEERING-TRANSACTIONS OF THE ASME
(2016)
Article
Chemistry, Analytical
M. Taguchi, N. Schwalb, Y. Rong, D. C. Vanegas, N. Garland, M. Tan, H. Yamaguchi, J. C. Claussen, E. S. McLamore
Article
Engineering, Industrial
Fukuo Hashimoto, Hitomi Yamaguchi, Peter Krajnik, Konrad Wegener, Rahul Chaudhari, Hans-Werner Hoffmeister, Friedrich Kuster
CIRP ANNALS-MANUFACTURING TECHNOLOGY
(2016)
Article
Engineering, Mechanical
Weisi Li, Ping Zhou, Wei-Chen Lin, Valens Nteziyaremye, Hitomi Yamaguchi, Dongming Guo, Albert Shih
INTERNATIONAL JOURNAL OF MECHANICAL SCIENCES
(2016)
Article
Engineering, Manufacturing
Hitomi Yamaguchi, Patrick Hendershot, Radu Pavel, Jonathan C. Iverson
JOURNAL OF MANUFACTURING PROCESSES
(2016)
Article
Engineering, Biomedical
Pei-Ying Wu, Hamit Kahraman, Hitomi Yamaguchi
JOURNAL OF MEDICAL DEVICES-TRANSACTIONS OF THE ASME
(2017)
Article
Engineering, Industrial
Daniel Ross, Hitomi Yamaguchi
CIRP ANNALS-MANUFACTURING TECHNOLOGY
(2018)
Article
Engineering, Industrial
Hitomi Yamaguchi, Mingshuo Li, Kotaro Hanada
CIRP ANNALS-MANUFACTURING TECHNOLOGY
(2019)
Article
Engineering, Industrial
Jan C. Aurich, Benjamin Kirsch, Dinesh Setti, Dragos Axinte, Anthony Beaucamp, Paul Butler-Smith, Hitomi Yamaguchi
CIRP ANNALS-MANUFACTURING TECHNOLOGY
(2019)
Article
Engineering, Multidisciplinary
S. Kodama, H. Yamaguchi, K. Shimada, M. Mizutani, T. Kuriyagawa
PRECISION ENGINEERING-JOURNAL OF THE INTERNATIONAL SOCIETIES FOR PRECISION ENGINEERING AND NANOTECHNOLOGY
(2019)
Article
Engineering, Manufacturing
Daniel Ross, Hitomi Yamaguchi
CIRP JOURNAL OF MANUFACTURING SCIENCE AND TECHNOLOGY
(2019)
Article
Materials Science, Ceramics
Julian Long, Daniel Ross, Erik Tastepe, Mikayla Lamb, Yusuke Funamoto, Daichi Shima, Tomosumi Kamimura, Hitomi Yamaguchi
JOURNAL OF THE AMERICAN CERAMIC SOCIETY
(2020)
Article
Engineering, Manufacturing
Daniel Ross, Yanming Wang, Hadyan Ramadhan, Hitomi Yamaguchi
Journal of Micro and Nano-Manufacturing
(2016)
Proceedings Paper
Automation & Control Systems
Max Stein, Hitomi Yamaguchi, Yoshitaka Morimoto, Fumiya Yoshimura, Akira Hasegawa, Kiego Takasugi
2016 INTERNATIONAL SYMPOSIUM ON FLEXIBLE AUTOMATION (ISFA)
(2016)
Article
Engineering, Industrial
Hitomi Yamaguchi, Omar Fergani, Pei-Ying Wu
CIRP ANNALS-MANUFACTURING TECHNOLOGY
(2017)