Improvement of electromigration reliability and diffusion of Cu films using coherent Cu(111)/Cr2O3(0001) interfaces

Title
Improvement of electromigration reliability and diffusion of Cu films using coherent Cu(111)/Cr2O3(0001) interfaces
Authors
Keywords
-
Journal
CHEMICAL PHYSICS LETTERS
Volume 542, Issue -, Pages 85-88
Publisher
Elsevier BV
Online
2012-06-05
DOI
10.1016/j.cplett.2012.05.071

Ask authors/readers for more resources

Create your own webinar

Interested in hosting your own webinar? Check the schedule and propose your idea to the Peeref Content Team.

Create Now

Ask a Question. Answer a Question.

Quickly pose questions to the entire community. Debate answers and get clarity on the most important issues facing researchers.

Get Started