Bonding of Bi2Te3-Based Thermoelectric Legs to Metallic Contacts Using Bi0.82Sb0.18 Alloy
Published 2015 View Full Article
- Home
- Publications
- Publication Search
- Publication Details
Title
Bonding of Bi2Te3-Based Thermoelectric Legs to Metallic Contacts Using Bi0.82Sb0.18 Alloy
Authors
Keywords
Thermoelectrics, Bi<sub>2</sub>Te<sub>3</sub>, bonding, Bi-Sb
Journal
JOURNAL OF ELECTRONIC MATERIALS
Volume 45, Issue 3, Pages 1296-1300
Publisher
Springer Nature
Online
2015-10-29
DOI
10.1007/s11664-015-4003-2
References
Ask authors/readers for more resources
Related references
Note: Only part of the references are listed.- Investigation of the Effect of MoSe2 on the Thermoelectric Properties of n-Type Bi2Te2.4Se0.6
- (2014) Tom Shalev et al. JOURNAL OF ELECTRONIC MATERIALS
- Structural stability of thermoelectric diffusion barriers: Experimental results and first principles calculations
- (2013) Hsiao-Hsuan Hsu et al. APPLIED PHYSICS LETTERS
- Effect of Se Substitution on Structural and Electrical Transport Properties of Bi0.4Sb1.6Se3x Te3(1−x) Hexagonal Rods
- (2013) Arej Kadhim et al. JOURNAL OF ELECTRONIC MATERIALS
- Understanding of the contact of nanostructured thermoelectric n-type Bi2Te2.7Se0.3 legs for power generation applications
- (2013) Weishu Liu et al. Journal of Materials Chemistry A
- Low temperature thermoelectric properties of melt spun Bi85Sb15 alloys
- (2012) Tingting Luo et al. INTERMETALLICS
- Thermoelectric, Structural, and Mechanical Properties of Spark-Plasma-Sintered Submicro- and Microstructured p-Type Bi0.5Sb1.5Te3
- (2012) N. Bomshtein et al. JOURNAL OF ELECTRONIC MATERIALS
- The texture related anisotropy of thermoelectric properties in bismuth telluride based polycrystalline alloys
- (2011) J. J. Shen et al. APPLIED PHYSICS LETTERS
- Evaluation of Diffusion Barrier Between Lead-Free Solder Systems and Thermoelectric Materials
- (2011) T.Y. Lin et al. JOURNAL OF ELECTRONIC MATERIALS
- Thermoelectric Property Studies on Cu-Doped n-type CuxBi2Te2.7Se0.3 Nanocomposites
- (2011) Wei-Shu Liu et al. Advanced Energy Materials
- Polarity effect on interfacial reactions at soldered junctions of electrically stressed thermoelectric modules
- (2010) Chien-Neng Liao et al. APPLIED PHYSICS LETTERS
- Generation of Nanosized Particles during Mechanical Alloying and Their Evolution through the Hot Extrusion Process in Bismuth-Telluride-Based Alloys
- (2010) D. Vasilevskiy et al. JOURNAL OF ELECTRONIC MATERIALS
- Figure of Merit of (Sb0.75Bi0.25)2−x In x Te2.8Se0.2 Single Crystals
- (2010) C. Drasar et al. JOURNAL OF ELECTRONIC MATERIALS
- Experimental Studies on Anisotropic Thermoelectric Properties and Structures of n-Type Bi2Te2.7Se0.3
- (2010) Xiao Yan et al. NANO LETTERS
- Unique nanostructures and enhanced thermoelectric performance of melt-spun BiSbTe alloys
- (2009) Wenjie Xie et al. APPLIED PHYSICS LETTERS
- Interface characterization of nickel contacts to bulk bismuth tellurium selenide
- (2009) O. D. Iyore et al. SURFACE AND INTERFACE ANALYSIS
- A thermodynamic assessment of Ni–Sb system
- (2008) Yubi Zhang et al. CALPHAD-COMPUTER COUPLING OF PHASE DIAGRAMS AND THERMOCHEMISTRY
- The ternary bismuth–iron–antimony system: Experimental phase diagram study and thermodynamic evaluation
- (2008) D. Boa et al. CALPHAD-COMPUTER COUPLING OF PHASE DIAGRAMS AND THERMOCHEMISTRY
- Thermoelectric and transport properties of n-type Bi2Te3 nanocomposites
- (2008) N. Gothard et al. JOURNAL OF APPLIED PHYSICS
- High-Thermoelectric Performance of Nanostructured Bismuth Antimony Telluride Bulk Alloys
- (2008) B. Poudel et al. SCIENCE
Discover Peeref hubs
Discuss science. Find collaborators. Network.
Join a conversationCreate your own webinar
Interested in hosting your own webinar? Check the schedule and propose your idea to the Peeref Content Team.
Create Now