Evaluation of Electroplated Co-P Film as Diffusion Barrier Between In-48Sn Solder and SiC-Dispersed Bi2Te3 Thermoelectric Material
Published 2015 View Full Article
- Home
- Publications
- Publication Search
- Publication Details
Title
Evaluation of Electroplated Co-P Film as Diffusion Barrier Between In-48Sn Solder and SiC-Dispersed Bi2Te3 Thermoelectric Material
Authors
Keywords
In-Sn, Co-P, diffusion barrier, thermoelectric device, Bi<sub>2</sub>Te<sub>3</sub>
Journal
JOURNAL OF ELECTRONIC MATERIALS
Volume 44, Issue 6, Pages 2007-2014
Publisher
Springer Nature
Online
2015-01-30
DOI
10.1007/s11664-015-3642-7
References
Ask authors/readers for more resources
Related references
Note: Only part of the references are listed.- Interfacial reaction between Sn–Ag–Cu solder and Co–P films with various microstructures
- (2013) Nianduan Lu et al. ACTA MATERIALIA
- Structural stability of thermoelectric diffusion barriers: Experimental results and first principles calculations
- (2013) Hsiao-Hsuan Hsu et al. APPLIED PHYSICS LETTERS
- Thermoelectric properties of Pb-doped bismuth telluride thin films deposited by magnetron sputtering
- (2013) Yang Zhou et al. JOURNAL OF ALLOYS AND COMPOUNDS
- Reliable contact fabrication on nanostructured Bi2Te3-based thermoelectric materials
- (2013) Shien-Ping Feng et al. PHYSICAL CHEMISTRY CHEMICAL PHYSICS
- Diffusion Soldering of Pb-Doped GeTe Thermoelectric Modules with Cu Electrodes Using a Thin-Film Sn Interlayer
- (2012) C.L. Yang et al. JOURNAL OF ELECTRONIC MATERIALS
- Thermal Cycling, Mechanical Degradation, and the Effective Figure of Merit of a Thermoelectric Module
- (2012) M. T. Barako et al. JOURNAL OF ELECTRONIC MATERIALS
- Thin-Film Thermoelectric Modules for Power Generation Using Focused Solar Light
- (2012) Mizue Mizoshiri et al. JOURNAL OF ELECTRONIC MATERIALS
- Evaluation of Diffusion Barrier Between Pure Sn and Te
- (2012) Chang-Yen Ko et al. JOURNAL OF ELECTRONIC MATERIALS
- Temperature dependence of the Raman spectra of Bi2Te3 and Bi0.5Sb1.5Te3 thermoelectric films
- (2012) Duanhui Li et al. Physica Status Solidi-Rapid Research Letters
- Dependence of interfacial adhesion of Co–P film on its microstructure
- (2012) Nianduan Lu et al. SURFACE & COATINGS TECHNOLOGY
- Diffusion at interfaces of micro thermoelectric devices
- (2011) Nam-Ho Bae et al. CURRENT APPLIED PHYSICS
- Synthesis and Characterization of Ultrasonic-Assisted Electroplated Co–P Films With Amorphous and Nanocrystalline Structures
- (2011) Nianduan Lu et al. IEEE TRANSACTIONS ON MAGNETICS
- Evaluation of Diffusion Barrier Between Lead-Free Solder Systems and Thermoelectric Materials
- (2011) T.Y. Lin et al. JOURNAL OF ELECTRONIC MATERIALS
- Fluxless Bonding of Bismuth Telluride Chips to Alumina Using Ag–In System for High Temperature Thermoelectric Devices
- (2011) Wen P. Lin et al. IEEE Transactions on Components Packaging and Manufacturing Technology
- Fabrication and evaluation of microscale thermoelectric modules of Bi2Te3-based alloys
- (2010) Da-Wei Liu et al. JOURNAL OF MICROMECHANICS AND MICROENGINEERING
- Electronic structures and stability of Ni/Bi2Te3and Co/Bi2Te3interfaces
- (2010) Ka Xiong et al. JOURNAL OF PHYSICS D-APPLIED PHYSICS
- Low Resistance Ohmic Contacts to Bi[sub 2]Te[sub 3] Using Ni and Co Metallization
- (2010) Rahul P. Gupta et al. JOURNAL OF THE ELECTROCHEMICAL SOCIETY
- Micromachined thermoelectric IR sensors fabricated by a self-aligned process
- (2010) Dehui Xu et al. Smart Materials and Structures
- Interface Characterization of Cobalt Contacts on Bismuth Selenium Telluride for Thermoelectric Devices
- (2009) R. P. Gupta et al. ELECTROCHEMICAL AND SOLID STATE LETTERS
- On-chip cooling by superlattice-based thin-film thermoelectrics
- (2009) Ihtesham Chowdhury et al. Nature Nanotechnology
- Realization of a wearable miniaturized thermoelectric generator for human body applications
- (2009) Ziyang Wang et al. SENSORS AND ACTUATORS A-PHYSICAL
- Interface characterization of nickel contacts to bulk bismuth tellurium selenide
- (2009) O. D. Iyore et al. SURFACE AND INTERFACE ANALYSIS
- Diffusion of nickel and tin in p-type (Bi,Sb)2Te3 and n-type Bi2(Te,Se)3 thermoelectric materials
- (2008) Y. C. Lan et al. APPLIED PHYSICS LETTERS
- Thermoelectric micro converters for cooling and energy-scavenging systems
- (2008) L M Goncalves et al. JOURNAL OF MICROMECHANICS AND MICROENGINEERING
- High-Thermoelectric Performance of Nanostructured Bismuth Antimony Telluride Bulk Alloys
- (2008) B. Poudel et al. SCIENCE
- Thermoelectric and mechanical properties of nano-SiC-dispersed Bi2Te3 fabricated by mechanical alloying and spark plasma sintering
- (2007) Li-Dong Zhao et al. JOURNAL OF ALLOYS AND COMPOUNDS
Discover Peeref hubs
Discuss science. Find collaborators. Network.
Join a conversationAsk a Question. Answer a Question.
Quickly pose questions to the entire community. Debate answers and get clarity on the most important issues facing researchers.
Get Started