Evaluation of Electroplated Co-P Film as Diffusion Barrier Between In-48Sn Solder and SiC-Dispersed Bi2Te3 Thermoelectric Material

Title
Evaluation of Electroplated Co-P Film as Diffusion Barrier Between In-48Sn Solder and SiC-Dispersed Bi2Te3 Thermoelectric Material
Authors
Keywords
In-Sn, Co-P, diffusion barrier, thermoelectric device, Bi<sub>2</sub>Te<sub>3</sub>
Journal
JOURNAL OF ELECTRONIC MATERIALS
Volume 44, Issue 6, Pages 2007-2014
Publisher
Springer Nature
Online
2015-01-30
DOI
10.1007/s11664-015-3642-7

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