Self-assembly: a review of recent developments

Purpose - The purpose of this paper is to provide a review of recent progress in self-assembly technology, principally in the microelectronics context. Design/methodology/approach - First, the paper discusses the application of nanoscale self-assembly techniques to microelectronic and related components and then considers research involving larger devices. Findings - The paper shows that a range of self-assembly techniques is being used to fabricate both production and experimental microelectronic devices, often with the aim of developing alternatives to copper wire interconnects. Other, experimental self-assembly techniques are being developed for the packaging and mounting of microelectronic components on substrates. Originality/value - Provides a useful, detailed review of the use of self-assembly techniques at the nanoscale, microscale and macroscale.