Investigation of the thermal decomposition of printed circuit boards (PCBs) via thermogravimetric analysis (TGA) and analytical pyrolysis (Py–GC/MS)

Published 2015 View Full Article

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Title
Investigation of the thermal decomposition of printed circuit boards (PCBs) via thermogravimetric analysis (TGA) and analytical pyrolysis (Py–GC/MS)
Authors
Keywords
Pyrolysis, Printed circuit boards, Py–GC/MS, TGA, PCBs, e-Waste
Journal
JOURNAL OF ANALYTICAL AND APPLIED PYROLYSIS
Volume 115, Issue -, Pages 337-343
Publisher
Elsevier BV
Online
2015-08-19
DOI
10.1016/j.jaap.2015.08.012

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