In situ quantitative study of microstructural evolution at the interface of Sn3.0Ag0.5Cu/Cu solder joint during solid state aging

Published 2015 View Full Article

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Title
In situ quantitative study of microstructural evolution at the interface of Sn3.0Ag0.5Cu/Cu solder joint during solid state aging
Authors
Keywords
Interfacial reaction, Solder joint, Quantitative, Microstructure, Nanoindentation
Journal
JOURNAL OF ALLOYS AND COMPOUNDS
Volume 634, Issue -, Pages 94-98
Publisher
Elsevier BV
Online
2015-02-17
DOI
10.1016/j.jallcom.2015.02.088

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