Ti addition to enhance corrosion resistance of Sn–Zn solder alloy by tailoring microstructure

Published 2015 View Full Article

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Title
Ti addition to enhance corrosion resistance of Sn–Zn solder alloy by tailoring microstructure
Authors
Keywords
Lead-free solder, Titanium, Corrosion, Impedance spectroscopy, Microstructure
Journal
JOURNAL OF ALLOYS AND COMPOUNDS
Volume 644, Issue -, Pages 113-118
Publisher
Elsevier BV
Online
2015-05-03
DOI
10.1016/j.jallcom.2015.04.168

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