Effect of thermal cycling on microstructure evolution and elements diffusion behavior near the interface of Ni/NiAl diffusion couple

Title
Effect of thermal cycling on microstructure evolution and elements diffusion behavior near the interface of Ni/NiAl diffusion couple
Authors
Keywords
Intermetallics, Diffusion, Microstructure
Journal
JOURNAL OF ALLOYS AND COMPOUNDS
Volume 642, Issue -, Pages 117-123
Publisher
Elsevier BV
Online
2015-04-21
DOI
10.1016/j.jallcom.2015.04.095

Ask authors/readers for more resources

Reprint

Contact the author

Publish scientific posters with Peeref

Peeref publishes scientific posters from all research disciplines. Our Diamond Open Access policy means free access to content and no publication fees for authors.

Learn More

Find the ideal target journal for your manuscript

Explore over 38,000 international journals covering a vast array of academic fields.

Search