Numerical simulation of mixed convection air-cooling of electronic components mounted in an inclined channel

Title
Numerical simulation of mixed convection air-cooling of electronic components mounted in an inclined channel
Authors
Keywords
-
Journal
APPLIED THERMAL ENGINEERING
Volume 31, Issue 11-12, Pages 2052-2062
Publisher
Elsevier BV
Online
2011-04-16
DOI
10.1016/j.applthermaleng.2011.03.021

Ask authors/readers for more resources

Discover Peeref hubs

Discuss science. Find collaborators. Network.

Join a conversation

Create your own webinar

Interested in hosting your own webinar? Check the schedule and propose your idea to the Peeref Content Team.

Create Now