Effect of composition on electroless deposited Ni–Co–P alloy thin films as a diffusion barrier for copper metallization

Published 2012 View Full Article

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Title
Effect of composition on electroless deposited Ni–Co–P alloy thin films as a diffusion barrier for copper metallization
Authors
Keywords
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Journal
APPLIED SURFACE SCIENCE
Volume 258, Issue 20, Pages 7962-7967
Publisher
Elsevier BV
Online
2012-05-05
DOI
10.1016/j.apsusc.2012.04.145

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