Journal
APPLIED PHYSICS LETTERS
Volume 94, Issue 21, Pages -Publisher
AMER INST PHYSICS
DOI: 10.1063/1.3142866
Keywords
dielectric liquids; dielectric thin films; liquid films; thermal conductivity; thermal resistance
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Funding
- U. S. Air Force Office of Scientific Research MURI [F9550-06-10326]
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We present a reversible thermal interface that can circumvent limitations of direct solid-solid contacts. A thin continuous layer of a dielectric liquid is formed between two solid substrates to provide a low-resistance heat conduction path. The liquid is initially confined in an array of discrete microchannels and undergoes reversible morphological transition into a continuous film as the loading pressure is increased. We theoretically and experimentally determine the relationship between loading pressure and liquid morphology. The interfaces can achieve thermal resistance comparable to that of solid-solid contacts but at loading pressures orders of magnitude smaller.
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