Thermally stable amorphous (AlMoNbSiTaTiVZr)50N50 nitride film as diffusion barrier in copper metallization

Published 2008 View Full Article

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Title
Thermally stable amorphous (AlMoNbSiTaTiVZr)50N50 nitride film as diffusion barrier in copper metallization
Authors
Keywords
-
Journal
APPLIED PHYSICS LETTERS
Volume 92, Issue 5, Pages 052109
Publisher
AIP Publishing
Online
2008-02-09
DOI
10.1063/1.2841810

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