The R1 Conjugative Plasmid Increases Escherichia coli Biofilm Formation through an Envelope Stress Response

Title
The R1 Conjugative Plasmid Increases Escherichia coli Biofilm Formation through an Envelope Stress Response
Authors
Keywords
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Journal
APPLIED AND ENVIRONMENTAL MICROBIOLOGY
Volume 74, Issue 9, Pages 2690-2699
Publisher
American Society for Microbiology
Online
2008-03-15
DOI
10.1128/aem.02809-07

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