Hot embossing and thermal bonding of poly(methyl methacrylate) microfluidic chips using positive temperature coefficient ceramic heater

Title
Hot embossing and thermal bonding of poly(methyl methacrylate) microfluidic chips using positive temperature coefficient ceramic heater
Authors
Keywords
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Journal
ANALYTICAL AND BIOANALYTICAL CHEMISTRY
Volume 401, Issue 8, Pages 2657-2665
Publisher
Springer Nature
Online
2011-09-16
DOI
10.1007/s00216-011-5377-5

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