Development of hybrid process for double-side flexible printed circuit boards using roll-to-roll gravure printing, via-hole printing, and electroless plating
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Title
Development of hybrid process for double-side flexible printed circuit boards using roll-to-roll gravure printing, via-hole printing, and electroless plating
Authors
Keywords
Flexible printed circuit board, Roll-to-roll, Printed electronics, Double-side printing, Via hole, Reliability test
Journal
INTERNATIONAL JOURNAL OF ADVANCED MANUFACTURING TECHNOLOGY
Volume 82, Issue 9-12, Pages 1921-1931
Publisher
Springer Nature
Online
2015-07-13
DOI
10.1007/s00170-015-7507-2
References
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