Article
Engineering, Mechanical
Hongfei Tao, Yuanhang Liu, Dewen Zhao, Xinchun Lu
Summary: This work explores the mechanism of ductile deformation and subsurface damage evolution of silicon wafers during the ultra-precision grinding process. It provides insights into the phase transition properties and atomic-scale subsurface defects of ground silicon wafers. The influence of abrasive interactions on subsurface deformation is investigated using nanoscratch tests.
TRIBOLOGY INTERNATIONAL
(2023)
Article
Chemistry, Physical
Shang Gao, Honggang Li, Han Huang, Renke Kang
Summary: In this study, the morphologies and damage patterns of ground and lapped silicon surfaces were compared, showing that the lapped surface had a softer damage layer and a higher bearing area ratio, resulting in a lower material removal rate.
APPLIED SURFACE SCIENCE
(2022)
Article
Engineering, Mechanical
Sheng Wang, Qingliang Zhao, Xiaodong Yang
Summary: This study investigates the surface and subsurface microscopic characteristics of sapphire through ultra-precision grinding experiments. The results show that a ductile damage-free surface with a roughness of Sa10nm can be achieved. The micro-characteristics of rough grinding and ultra-precision grinding surfaces are found to be different. The study also discusses the effects of abrasive particle size on surface roughness and grinding wheel wear, and examines subsurface characteristics through molten KOH corrosion.
TRIBOLOGY INTERNATIONAL
(2022)
Article
Engineering, Mechanical
Zaiwei Liu, Bin Lin, Xiaohu Liang, Anyao Du
Summary: In this paper, a technology for estimating the mechanical properties and residual stress of machined surfaces, especially for ground silicon wafer, based on laser-excited surface acoustic waves (LSAWs) is developed. Bayesian inversion and Markov chain Monte Carlo (MCMC) method are used to estimate the elastic constants and residual stress of the subsurface damage (SSD) layer, and corresponding uncertainties are provided. Experimental results demonstrate that this technology can accurately characterize SSD and residual stress.
MECHANICAL SYSTEMS AND SIGNAL PROCESSING
(2022)
Article
Engineering, Electrical & Electronic
Pierre Montmeat, Jerome Dechamp, Gregory Enyedi, Frank Fournel, Zacharoula Zavvou, Vincent Jousseaume
Summary: In this study, ultra-thin iCVD polysiloxane films were proposed as adhesives for silicon wafer bonding. It was found that the thickness and elaboration temperature of the polymer had no significant impact on bonding properties, but an increase in bonding temperature led to stronger adherence.
MATERIALS SCIENCE IN SEMICONDUCTOR PROCESSING
(2022)
Article
Materials Science, Ceramics
Huapan Xiao, Shenxin Yin, Hairong Wang, Yuhu Liu, Heng Wu, Rongguang Liang, Huajun Cao
Summary: Based on the indentation fracture mechanics of brittle materials, correlations between subsurface crack depth and scratch depth induced by different indenters are established, and theoretical models for surface damage and subsurface damage depths are developed. Experimental results show that the hybrid grit models can efficiently predict the depths of damage, reducing errors compared to other shaped grit models.
CERAMICS INTERNATIONAL
(2021)
Article
Engineering, Multidisciplinary
Shenxin Yin, Huapan Xiao, Heng Wu, Chunjin Wang, Chi Fai Cheung
Summary: A theoretical model is developed to accurately and quickly determine the surface roughness and subsurface damage depth of silicon wafers by considering fracture width. The model integrates digital image processing to extract fracture parameters and shows good agreement with experimental results. This image processing-based model provides a reasonable approach for estimating damages in silicon wafers during wire sawing.
PRECISION ENGINEERING-JOURNAL OF THE INTERNATIONAL SOCIETIES FOR PRECISION ENGINEERING AND NANOTECHNOLOGY
(2022)
Article
Engineering, Electrical & Electronic
Jingfei Yin, Qian Bai, Bi Zhang
Summary: This study presents a novel polarized laser scattering (PLS) method for detecting subsurface damage (SSD) in silicon wafers. The PLS signal is sensitive to the depth of SSD, and a relationship between the PLS signal and SSD depth is established for practical applications of the PLS method.
MATERIALS SCIENCE IN SEMICONDUCTOR PROCESSING
(2022)
Article
Engineering, Mechanical
Hongfei Tao, Yuanhang Liu, Dewen Zhao, Xinchun Lu
Summary: This paper investigates the impact of wheel spindle vibration on the surface topography of ground wafer. A mathematical model is proposed to analyze the dynamic behaviors of the spindle, and the vibration-induced errors are studied. A surface formation model is developed, considering various factors that affect the waviness of the surface. The experimental results are consistent with the simulation results, and the effect of vibration parameters on surface roughness is revealed.
INTERNATIONAL JOURNAL OF MECHANICAL SCIENCES
(2022)
Article
Engineering, Electrical & Electronic
John J. Gagliardi, Vincent D. Romero, Fabian Stolzenburg, Anatoly Z. Rosenflanz, Jason D. Anderson
Summary: Optimizing key components of Trizact (TM) Diamond Tile can significantly reduce subsurface damage (SSD) in a prime silicon wafer lapping (or grinding) process. With this SSD reduction, a conventional prime wafer finishing sequence can be improved by eliminating a step or reducing polishing requirements. Experimental results on 100 mm silicon wafers showed a reduction in maximum SSD from over 6 μm to about 2.5 μm, indicating a potential SSD well under 8 μm for 300 mm prime silicon wafers.
JOURNAL OF ELECTRONIC MATERIALS
(2023)
Article
Engineering, Electrical & Electronic
S. Herold, J. Acker
Summary: The study reveals that HNO3, H2O2, and H2SiF6 only oxidize tensile strained silicon areas and not unstrained silicon, while H2O2/HF and HNO3/HF have different etching mechanisms.
MATERIALS SCIENCE IN SEMICONDUCTOR PROCESSING
(2021)
Article
Engineering, Mechanical
Yu Zhang, Renke Kang, Jiawei Ren, Hongye Lang, Shang Gao
Summary: To achieve high-quality surfaces and subsurfaces of ground silicon wafers, a method called chemo-mechanical grinding (CMG) has been developed, combining chemical reactions and grinding. This study focuses on understanding the mechanical effect of abrasives in the CMG process, by conducting nanoscratching experiments on silicon with CeO2 and diamond indenters. Experimental investigations and simulation results suggest that material removal of silicon in CMG process relies on chemical reactions between soft abrasives and silicon, rather than the mechanical stress on silicon generated by these abrasives.
INTERNATIONAL JOURNAL OF MECHANICAL SCIENCES
(2023)
Article
Chemistry, Analytical
Wei Yang, Yaguo Li
Summary: The study investigated the impact of machining factors on subsurface damage depth in single-crystal silicon, finding that adjusting parameters such as diamond grit size, grinding wheel speed, and feeding rate can reduce the depth of SSD. By optimizing parameters based on crystal orientation, SSD depth in silicon can be decreased.
Article
Materials Science, Ceramics
Siqian Gong, Xiaomin Zhu, Yao Sun, Benjia Tang, Zhipeng Su
Summary: This study experimentally investigated the effects of helical micro abrasive tools on sapphire, analyzing the impact of tool structure and process parameters on surface quality and subsurface damage. A qualitative evaluation method for subsurface damage was proposed.
CERAMICS INTERNATIONAL
(2022)
Article
Engineering, Mechanical
Hongfei Tao, Yuanhang Liu, Dewen Zhao, Xinchun Lu
Summary: This study proposes a new index, undeformed chip width, to analyze the stochastic characteristics in material removal process and predict the surface roughness of ground wafer. The relationship between undeformed chip width and surface roughness is discussed, and the developed models are verified through grinding experiments.
TRIBOLOGY INTERNATIONAL
(2022)
Article
Materials Science, Ceramics
Shuiping Tan, Yunpeng Wang, Hui Huang, Yueqin Wu, Han Huang
Summary: This study investigated the deformation mechanism of single crystal gallium nitride (GaN) under mechanical loading through nanoscratching, and characterized the scratch-induced surface/subsurface deformation using microscopy techniques. The results showed that the stress threshold for the elastic-plastic deformation transition of GaN crystal was relatively high compared to single crystal silicon and gallium oxide. Plastic deformation in the GaN sublayer was mainly dominated by slip, dislocation, and lattice distortion under relatively low normal loads, but these defects were accompanied with grain rotation when the load was sufficiently high. The thickness of the damage layer was directly related to the ratio of lateral force to normal force during scratching.
CERAMICS INTERNATIONAL
(2022)
Article
Engineering, Multidisciplinary
Yu Yin, Yitian Zhao, Kai En Koey, Qiyang Tan, Ming-Xing Zhang, Han Huang
Summary: This work introduces a new approach to in-situ synthesize high-entropy composite (HEC) with high age-hardening ability and superior wear resistance. The composite shows enhanced hardness and compressive yield strength after aging at 800 degrees C for 96 h, resulting in significantly improved wear resistance compared to high-chromium cast iron. The unique microstructure of the HEC, including in-situ formed carbides, eutectic structures, and precipitates, effectively strengthens the soft FCC matrix and prevents severe delamination and cracking.
COMPOSITES PART B-ENGINEERING
(2022)
Article
Physics, Applied
Weikang Lin, Yitian Zhao, Feng Wang, Han Huang, Mingyuan Lu
Summary: A microcantilever bending technique was used to evaluate the interfacial adhesion of a silicon nitride film on a gallium arsenide substrate. The results obtained from experiments and simulations provided values for the interfacial fracture strength and interfacial toughness.
JOURNAL OF PHYSICS D-APPLIED PHYSICS
(2022)
Article
Materials Science, Multidisciplinary
Zhuo Liu, Wei Cheng, Dekui Mu, Yueqin Wu, Qiaoli Lin, Xipeng Xu, Han Huang
Summary: The influence of early-stage C diffusion on the microstructures of chromium carbides formed in the solid-state interface reaction was investigated using XPS and TEM techniques. It was found that the catalytically converted disordered carbon (DC) was the first phase formed in the early-stage reaction. Abnormal C diffusion in sputtered Cr was observed for the first time, which affected the interfacial microstructures. The formation behaviors of Cr7C3 and Cr23C6 carbides were examined, and Cr23C6 was found to be the dominant phase formed in the interface reaction. The origin and evolution of crystal twins at grain boundaries between interfacial carbides were also studied using HRTEM.
MATERIALS CHARACTERIZATION
(2023)
Article
Nanoscience & Nanotechnology
Yu Yin, Wangrui Ren, Qiyang Tan, Houwen Chen, Han Huang, Ming-Xing Zhang
Summary: A cost-effective high entropy alloy with a single face-centred cubic matrix is developed to enhance the application potential of cryogenic high entropy alloys. It exhibits temperature-dependent tensile properties, with increased yield strength, tensile strength, and ductility at lower temperatures. The alloy stands out with its relatively low cost, superior strain hardening capacity, and exceptional strength-ductility synergy at 77K, making it a promising material candidate for cryogenic applications.
MATERIALS SCIENCE AND ENGINEERING A-STRUCTURAL MATERIALS PROPERTIES MICROSTRUCTURE AND PROCESSING
(2023)
Article
Chemistry, Analytical
Sahar Dehkhoda, Mingyuan Lu, Han Huang
Summary: An innovative push-out technique was used to assess the interfacial toughness of the embedded SiN/GaAs interface in a multilayer system. By minimizing plastic deformation in the soft Au layer and inducing tensile stress to the SiN/GaAs interface, the bilayer detached from the GaAs substrate with little plasticity. The interfacial toughness of the SiN/GaAs interface was calculated as 4.86 +/- 0.96 J m(-2) through energy analysis of the load-displacement curves.
Article
Physics, Applied
Dingbang Yang, Junjie Jiang, Jiaxin Chen, Xiao Guo, Xinhui Yang, Xiaoming Zheng, Chuyun Deng, Haipeng Xie, Fei Song, Fangping Ouyang, Xiaoming Yuan, Mingxing Chen, Han Huang
Summary: We fabricated high quality 2D/3D MoS2/MoO2 heterostructures with atomic clean interface using one-step chemical vapor deposition. The study revealed the specific epitaxial relationship between MoS2 and MoO2 and demonstrated the interfacial charge transfer from MoS2 to MoO2. The in-plane anisotropy induced by MoO2 in MoS2 expands the application of isotropic MoS2 in polarization-dependent fields.
APPLIED PHYSICS LETTERS
(2023)
Article
Engineering, Mechanical
Shang Gao, Haoxiang Wang, Han Huang, Renke Kang
Summary: This work investigated the deformation and crack formation of monocrystalline 4H-SiC involved in single grit grinding using molecular dynamics (MD) simulation. The mechanism for crack initiation and propagation in mono-crystalline 4H-SiC was revealed for the first time. Stress analysis demonstrated the driving forces and propagation directions of the cracks.
INTERNATIONAL JOURNAL OF MECHANICAL SCIENCES
(2023)
Article
Materials Science, Multidisciplinary
Zhuo Liu, Wei Cheng, Dekui Mu, Qiaoli Lin, Xipeng Xu, Han Huang
Summary: This study critically examined the solid-state interface reaction between single-crystal synthetic diamond and chromium metal, revealing the role of crystal orientation in the formation and growth of interfacial products. The catalytically converted carbon was found to be formed prior to chromium carbides, contrary to previous studies. The interfacial strain distribution was quantitatively measured, and an improved strain concentration was observed after the ripening of interfacial carbides. The article proposed an approach for tailoring the interfacial microstructure between synthetic diamond and bonding metals.
JOURNAL OF MATERIALS SCIENCE & TECHNOLOGY
(2023)
Review
Biology
Yian Wang, Qijia Yan, Chunmei Fan, Yongzhen Mo, Yumin Wang, Xiayu Li, Qianjin Liao, Can Guo, Guiyuan Li, Zhaoyang Zeng, Wei Xiong, He Huang
Summary: Cancer is a major cause of death globally, posing a significant burden on society. In China, it is a growing challenge for the healthcare system. This study analyzes recent data on cancer incidence, mortality, and survival rates in China in 2016, identifying key risk factors and discussing potential countermeasures for prevention and treatment.
SCIENCE CHINA-LIFE SCIENCES
(2023)
Article
Engineering, Manufacturing
Danni Huang, Xiyu Yao, Yinghao Zhou, Qiang Zhu, Yaxin Tang, Han Huang, Ming-Xing Zhang, Ming Yan
Summary: Laserengineered net shaping (LENS) is a promising method to fabricate beta-solidifying TiAl alloy components for high temperature applications in turbine engines. However, the high brittleness of this alloy leads to cracking during the printing process. Grain refinement was introduced to overcome this issue, but it reduces the creep resistance at elevated temperatures. Postproduction heat treatment is required to tailor the mechanical properties of the alloy and restore its creep-resistant performance.
ADDITIVE MANUFACTURING
(2023)
Article
Chemistry, Physical
Xuliang Li, Zhiqi Fan, Shuiquan Huang, Mingyuan Lu, Han Huang
Summary: Determining the brittle-to-ductile transition (BDT) threshold is crucial for efficient machining processes of brittle materials. This study investigated the effects of tip shape and microstructural variation on the BDT behavior of single-crystal silicon and gallium arsenide. The critical cutting depth for BDT was influenced by both material microstructure and tip shape, with stress distribution and microstructure evolution being impacted. Using a sharp tip, silicon had a slightly smaller critical cutting depth than gallium arsenide, while with a blunt tip, gallium arsenide had a smaller critical cutting depth due to its higher brittleness index and density of crystallite defects.
APPLIED SURFACE SCIENCE
(2023)
Article
Nanoscience & Nanotechnology
Yu Yin, Qiyang Tan, Nan Yang, Xingrui Chen, Wangrui Ren, Lei Liu, Houwen Chen, Andrej Atrens, Ninshu Ma, Han Huang, Ming-Xing Zhang
Summary: In this study, a cost-effective Fe35Ni35Cr20Mo5Al5 high entropy alloy (HEA) with ultrafine microstructure (UFM) was successfully produced by manipulating the concurrent precipitation and recrystallization process. The UFM-HEA exhibited exceptional mechanical properties, including high yield strength, tensile strength and uniform elongation, as well as superior corrosion resistance compared to 316L stainless steel. This strategy not only provides insights into the development of new-generation cryogenic HEAs, but also enhances their industrial application potential.
MATERIALS SCIENCE AND ENGINEERING A-STRUCTURAL MATERIALS PROPERTIES MICROSTRUCTURE AND PROCESSING
(2023)
Article
Engineering, Mechanical
Yongqiang Wang, Shuaiyang Zhang, Hao Xia, Yueqin Wu, Han Huang
Summary: This study used molecular dynamics simulation to investigate the cutting of GaN along different crystal orientations. The simulation revealed distinct outcomes for different cutting directions, with enhanced removal efficiency and generation of more dislocations when cutting on a-plane or along the [-2110] direction on m-plane. However, cutting on c-plane or along the [0001] direction on m-plane showed the potential for achieving better surface integrity. This study provides valuable insights into the effect of crystallite orientation on the cutting performance of GaN and demonstrates the importance of appropriate selection of cutting directions for improved surface quality.
INTERNATIONAL JOURNAL OF MECHANICAL SCIENCES
(2023)
Review
Engineering, Multidisciplinary
James L. Mead, Shiliang Wang, Soeren Zimmermann, Sergej Fatikow, Han Huang
Summary: This review article aims to compile and evaluate recent experimental techniques for characterizing the adhesion behavior of interfaces formed by 1D materials. It discusses the conformation of 1D materials to surfaces, the coupling of adhesion and friction during interfacial attachment and detachment, the use of 1D materials in nanocomposites, and the potential influence of environmental conditions on 1D interfacial interactions. It also provides a brief perspective on ongoing challenges and future directions in the field.
