Towards the use of mushroom-capped dry adhesives in outer space: Effects of low pressure and temperature on adhesion strength

Title
Towards the use of mushroom-capped dry adhesives in outer space: Effects of low pressure and temperature on adhesion strength
Authors
Keywords
-
Journal
AEROSPACE SCIENCE AND TECHNOLOGY
Volume 29, Issue 1, Pages 185-190
Publisher
Elsevier BV
Online
2013-03-22
DOI
10.1016/j.ast.2013.03.003

Ask authors/readers for more resources

Find Funding. Review Successful Grants.

Explore over 25,000 new funding opportunities and over 6,000,000 successful grants.

Explore

Discover Peeref hubs

Discuss science. Find collaborators. Network.

Join a conversation