Towards the use of mushroom-capped dry adhesives in outer space: Effects of low pressure and temperature on adhesion strength

Published 2013 View Full Article

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Title
Towards the use of mushroom-capped dry adhesives in outer space: Effects of low pressure and temperature on adhesion strength
Authors
Keywords
-
Journal
AEROSPACE SCIENCE AND TECHNOLOGY
Volume 29, Issue 1, Pages 185-190
Publisher
Elsevier BV
Online
2013-03-22
DOI
10.1016/j.ast.2013.03.003

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