Journal
ACTA MATERIALIA
Volume 64, Issue -, Pages 356-366Publisher
PERGAMON-ELSEVIER SCIENCE LTD
DOI: 10.1016/j.actamat.2013.10.049
Keywords
Copper wire bonding; Interfacial microstructure; Intermetallic compounds; Phase transformation; Transmission electron microscopy
Funding
- Basic Science Research Program through the National Research Foundation of Korea (NRF)
- Ministry of Education, Science and Technology [2010-0020945]
- BK21 Plus
- Ministry of Education, Korea [31Z20130012978]
- NRF grant
- Korea government [MSIP] [2012-0009451]
- Fundamental R&D Program for Core Technology of Materials
- Ministry of Commerce, Industry and Energy, Republic of Korea
- National Research Foundation of Korea [2010-0020945] Funding Source: Korea Institute of Science & Technology Information (KISTI), National Science & Technology Information Service (NTIS)
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A comparative study on the difference in interfacial behavior of thermally aged Cu wire bonding with Al and Au pads was conducted using transmission electron microscopy. During high-temperature lifetime testing of Cu wire bonding with Al and Au pads at 175 degrees C for up to 2000 h, different growth rates and growth characteristics were investigated in the Cu-Al intermetallic compounds (IMCs), including CuAl2, CuAl and Cu9Al4, and in the Cu-Au IMCs, including (Au,Cu), Cu3Au and (Cu,Au). Because of the lower growth rates and greater ductility of Cu-Au IMCs compared to those of Cu-Al IMCs, the Cu wire bonding with the Au pad showed relatively better thermal aging properties of bond pull strength and ball shear strength than those with the Al pad counterpart. In this study, the coherent interfaces were found to retard the growth of IMCs, and a variety of orientation relationships between wire, pad and interfacial IMCs were identified. (C) 2013 Acta Materialia Inc. Published by Elsevier Ltd. All rights reserved.
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