Journal
ACTA MATERIALIA
Volume 60, Issue 4, Pages 1889-1904Publisher
PERGAMON-ELSEVIER SCIENCE LTD
DOI: 10.1016/j.actamat.2011.10.025
Keywords
Microstructure; Tensile; Slip; Twinning; Creep
Funding
- National Science Foundation Division of Material Research [DMR1107117]
- Spanish Ministry of Education [SAB2009-0045]
- Spanish Ministry of Science and Innovation [MAG-NO2008-1028-CENIT]
- Direct For Mathematical & Physical Scien
- Division Of Materials Research [1107117] Funding Source: National Science Foundation
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A rolled AZ31 alloy was tensile tested in a scanning electron microscope at 323 K (50 degrees C), 423 K (150 degrees C), and 523 K (250 degrees C) in order to analyze the deformation mechanisms in situ. Electron backscatter diffraction was performed both before and after straining. There was a significant difference in the activity of the various deformation modes at the three test temperatures and the mechanical anisotropy was considerably reduced with temperature. At 323 K (50 degrees C) extension twinning, basal, prismatic < a >, and pyramidal < c+a > slip were active. Twinning disappeared above 323 K (50 degrees C), suggesting that the critical resolved shear stress (CRSS) of non-basal systems becomes less than that of twinning at T<423 K (150 degrees C). Plasticity was controlled at high temperature by a combination of basal and prismatic < a > slip. From 423 K (150 degrees C) to 523 K (250 degrees C), a transition occurs in the dominant deformation mechanism from basal + prismatic < a > to mainly prismatic < a > slip. This is consistent with a decrease of the CRSS of non-basal slip systems with increasing temperature. These results suggest that the observed drop in normal anisotropy with increasing temperature is likely to be the consequence of an increase in non-basal slip activity. In situ tensile-creep experiments, performed at approximately the yield stress at 423 K (150 degrees C), indicated that less slip and more grain boundary cracking occurs during creep deformation compared with the higher-stress tensile experiments. (C) 2011 Acta Materialia Inc. Published by Elsevier Ltd. All rights reserved.
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