Thermal stability and strength of deformation microstructures in pure copper

Title
Thermal stability and strength of deformation microstructures in pure copper
Authors
Keywords
-
Journal
ACTA MATERIALIA
Volume 60, Issue 10, Pages 4107-4116
Publisher
Elsevier BV
Online
2012-05-18
DOI
10.1016/j.actamat.2012.04.022

Ask authors/readers for more resources

Discover Peeref hubs

Discuss science. Find collaborators. Network.

Join a conversation

Find the ideal target journal for your manuscript

Explore over 38,000 international journals covering a vast array of academic fields.

Search