Effect of particle/matrix interfacial character on the high-temperature deformation and recrystallization behavior of Cu with dispersed Fe particles

The effect of particle/matrix interfacial character on the high-temperature deformation and recrystallization behavior Of Cu was systematically investigated at various temperatures from 723 to 973 K and at true strain rates between 4.1 x 10(-4) and 3.2 x 10(-2)s(-1). Cu with dispersed coherent gamma-Fe precipitates (Cu-gamma-Fe alloy) displayed lower yield stresses and higher flow stresses than CU containing incoherent alpha-Fe precipitates (Cu-c(-Fe alloy) under all testing conditions. Dynarnic recrystallization (DRX) took place rnore easily in the Cu-alpha-Fe alloy than in the Cu-gamma-Fe alloy. Although DRX was strongly impeded by the presence ol'the coherent precipitates at low to mediuml strains, the recrystallized regions gradually spread, accornpanied by transFort-nation of the coherent precipitates into incoherent ones. Such a large difference in the defomation and DRX behaviors depending on the particle/inatrix interfacial character is attributed to the stronger interaction between dislocations and the coherent particles. (c) 2008 Acta Materialia Inc. Published by Elsevier Ltd. All rights reserved.