Heat-to-Connect: Surface Commensurability Directs Organometallic One-Dimensional Self-Assembly

Title
Heat-to-Connect: Surface Commensurability Directs Organometallic One-Dimensional Self-Assembly
Authors
Keywords
-
Journal
ACS Nano
Volume 5, Issue 11, Pages 9093-9103
Publisher
American Chemical Society (ACS)
Online
2011-10-18
DOI
10.1021/nn203337v

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