Atomic Layer Deposition of a Film of Al2O3 on Electrodeposited Copper Foams To Yield Highly Effective Oxygen Carriers for Chemical Looping Combustion-Based CO2 Capture

A rapid electrochemical deposition protocol is reported to synthesize highly porous Cu foams serving as model oxygen carriers for chemical looping, a promising technology to reduce anthropogenic CO2 emission. To overcome the sintering-induced decay in the oxygen carrying capacity of unsupported Cu foams, Al2O3 films of different thicknesses (0.1-25 nm) are deposited onto the Cu foams via atomic layer deposition (ALD). An ALD-grown Al2O3 overcoat of 20 nm thickness (similar to 4 wt % Al2O3) is shown to be sufficient to ensure excellent redox cyclic stability. Al2O3-coated Cu foams exhibit a capacity retention of 96% over 10 redox cycles, outperforming their coprecipitated counterpart (equal Al2O3 content). The structural evolution of the stabilized foams is probed in detail and compared to benchmark materials to elucidate the stabilizing role of the Al2O3 overcoat. Upon heat treatment, the initially conformal Al2O3 overcoat induces a fragmentation of large Cu(O) branches into small particles. After multiple redox cycles, the Al2O3 overcoat transforms into sub micrometer-sized grains of aluminum-containing phases (delta-Al2O3, CuAl2O3, and CuAlO2) that are dispersed homogeneously within the CuO matrix. Finally, the diffusion of Cu through an Al2O3 layer upon heat treatment in an oxidizing atmosphere is probed in model thin films.