Journal
ACS APPLIED MATERIALS & INTERFACES
Volume 6, Issue 1, Pages 622-629Publisher
AMER CHEMICAL SOC
DOI: 10.1021/am404708z
Keywords
self-assembly; Cu nanosheets; conductive ink; flexible electronics; nanomaterials
Funding
- National Natural Science Foundation of China [51272235, 21301155]
- Zhejiang Provincial Natural Science Foundation of China [LR12E02001, LY13E020012]
- National High-tech R&D Program of China [2013AA031702]
- Program for New Century Excellent Talents in University [NCET-13-0998]
- Program for Changjiang Scholars and Innovative Research Team in University (PCSIRT)
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Large-area Cu nanosheets are synthesized by a strategy of Cu nanocrystal self-assembly, and then aqueous conductive Cu nanosheet ink is successfully prepared for direct writing on the conductive circuits of flexible electronics. The Cu nanocrystals, as building blocks, self-assemble along the < 111 > direction and grow into large-area nanosheets approximately 30-100 mu m in diameter and a few hundred nanometers in thickness. The laminar stackable patterns of the Cu nanosheet circuits increase the contact area of the Cu nanosheets and improve the stability of the conductor under stress, the result being that the Cu nanosheet circuits display excellent conductive performance during repeated folding and unfolding. Moreover, hetero-structures of Ag nanoparticle-coated Cu nanosheets are created to improve the thermal stability of the nanosheet circuits at high temperatures.
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