Direct diffusion bonding of immiscible tungsten and copper at temperature close to Copper's melting point

Published 2018 View Full Article

  1. Home
  2. Publications
  3. Publication Search
  4. Publication Details
Title
Direct diffusion bonding of immiscible tungsten and copper at temperature close to Copper's melting point
Authors
Keywords
W–Cu immiscible system, Direct diffusion bonding, Melting point of copper, Metallurgical interface
Journal
MATERIALS & DESIGN
Volume 137, Issue -, Pages 473-480
Publisher
Elsevier BV
Online
2017-10-19
DOI
10.1016/j.matdes.2017.10.052

Ask authors/readers for more resources

Protocol

Community support

Reagent

Community support

Reprint

Contact the author

Find Funding. Review Successful Grants.

Explore over 25,000 new funding opportunities and over 6,000,000 successful grants.

Explore

Become a Peeref-certified reviewer

The Peeref Institute provides free reviewer training that teaches the core competencies of the academic peer review process.

Get Started
Webinars Posters Questions Hubs Funding Journals Articles Connect Collections Reviewers About Us FAQs Mobile App Privacy Policy Terms of Use
© Peeref 2019-2024. All rights reserved.