Fracture of Silicon: Influence of rate, positioning accuracy, FIB machining, and elevated temperatures on toughness measured by pillar indentation splitting
Fracture of Silicon: Influence of rate, positioning accuracy, FIB machining, and elevated temperatures on toughness measured by pillar indentation splitting
Authors
Keywords
Silicon, Fracture mechanisms, Temperature dependence, Pillar indentation, Focused ion beam damage
Find the ideal target journal for your manuscript
Explore over 38,000 international journals covering a vast array of academic fields.
SearchAsk a Question. Answer a Question.
Quickly pose questions to the entire community. Debate answers and get clarity on the most important issues facing researchers.
Get Started