Fracture of Silicon: Influence of rate, positioning accuracy, FIB machining, and elevated temperatures on toughness measured by pillar indentation splitting

Title
Fracture of Silicon: Influence of rate, positioning accuracy, FIB machining, and elevated temperatures on toughness measured by pillar indentation splitting
Authors
Keywords
Silicon, Fracture mechanisms, Temperature dependence, Pillar indentation, Focused ion beam damage
Journal
MATERIALS & DESIGN
Volume 142, Issue -, Pages 340-349
Publisher
Elsevier BV
Online
2018-01-11
DOI
10.1016/j.matdes.2018.01.015

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