4.6 Article

Design and Performance Assessment of a Solid-State Microcooler for Thermal Neuromodulation

Journal

MICROMACHINES
Volume 9, Issue 2, Pages -

Publisher

MDPI
DOI: 10.3390/mi9020047

Keywords

solid-state cooling; microsystem integration; thermal simulation; thermal neuromodulation; microdevice packaging; biomedical microdevice; neuronal; implantable

Funding

  1. Foundation for Science and Technology (FCT) [PTDC/EEI-TEL/5250/2014]
  2. FEDER funds through Projecto [3599-PPCDT, SFRH/BD/100649/2014]
  3. Fundação para a Ciência e a Tecnologia [PTDC/EEI-TEL/5250/2014] Funding Source: FCT

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It is well known that neural activity can be modulated using a cooling device. The applications of this technique range from the treatment of medication-resistant cerebral diseases to brain functional mapping. Despite the potential benefits of such technique, its use has been limited due to the lack of suitable thermal modulators. This paper presents the design and validation of a solid-state cooler that was able to modulate the neural activity of rodents without the use of large and unpractical water pipes. A miniaturized thermal control solution based exclusively on solid-state devices was designed, occupying only 5 mm x 5 mm x 3 mm, and featuring the potential for wireless power and communications. The cold side of the device was cooled to 26 degrees C, while the hot side was kept below 43 degrees C. This range of temperatures is compatible with brain cooling and efficient enough for achieving some control of neural activity.

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