Thermal Modeling and Validation of a Real-World Mobile AP

Title
Thermal Modeling and Validation of a Real-World Mobile AP
Authors
Keywords
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Journal
IEEE Design & Test
Volume 35, Issue 1, Pages 55-62
Publisher
Institute of Electrical and Electronics Engineers (IEEE)
Online
2017-04-20
DOI
10.1109/mdat.2017.2695958

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