Microstructure and mechanical properties of Al-Cu joints diffusion-bonded with Ni or Ag interlayer

Published 2018 View Full Article

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Title
Microstructure and mechanical properties of Al-Cu joints diffusion-bonded with Ni or Ag interlayer
Authors
Keywords
Diffusion bonding, Aluminum, Copper, IMCs, Hardness, Tensile strength
Journal
VACUUM
Volume 147, Issue -, Pages 187-193
Publisher
Elsevier BV
Online
2017-11-06
DOI
10.1016/j.vacuum.2017.10.033

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