Encapsulated Copper Wire and Copper Mesh Capacitive Sensing for 3-D Printing Applications

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Title
Encapsulated Copper Wire and Copper Mesh Capacitive Sensing for 3-D Printing Applications
Authors
Keywords
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Journal
IEEE SENSORS JOURNAL
Volume 15, Issue 2, Pages 1280-1286
Publisher
Institute of Electrical and Electronics Engineers (IEEE)
Online
2014-09-17
DOI
10.1109/jsen.2014.2356973

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