4.5 Article

A fully automated temperature-dependent resistance measurement setup using van der Pauw method

Journal

REVIEW OF SCIENTIFIC INSTRUMENTS
Volume 89, Issue 3, Pages -

Publisher

AMER INST PHYSICS
DOI: 10.1063/1.4998340

Keywords

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Funding

  1. Department of Science and Technology [SB/FTP/ETA-381/2012, SB/EMEQ-032/2013]
  2. Department of Atomic Energy, Government of India [2013/20/34/2/BRNS]

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The van der Pauw (VDP) method is widely used to identify the resistance of planar homogeneous samples with four contacts placed on its periphery. We have developed a fully automated thin film resistance measurement setup using the VDP method with the capability of precisely measuring a wide range of thin film resistances from few m Omega up to 10 G Omega under controlled temperatures from room-temperature up to 600 degrees C. The setup utilizes a robust, custom-designed switching network board (SNB) for measuring current-voltage characteristics automatically at four different source-measure configurations based on the VDP method. Moreover, SNB is connected with low noise shielded coaxial cables that reduce the effect of leakage current as well as the capacitance in the circuit thereby enhancing the accuracy of measurement. In order to enable precise and accurate resistance measurement of the sample, wide range of sourcing currents/voltages are pre-determined with the capability of auto tuning for similar to 12 orders of variation in the resistances. Furthermore, the setup has been calibrated with standard samples and also employed to investigate temperature dependent resistance (few Omega-10 G Omega) measurements for various chalcogenide based phase change thin films (Ge2Sb2Te5, Ag5In5Sb60Te30, and In3SbTe2). This setup would be highly helpful for measurement of temperature-dependent resistance of wide range of materials, i.e., metals, semiconductors, and insulators illuminating information about structural change upon temperature as reflected by change in resistances, which are useful for numerous applications. Published by AIP Publishing.

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