Thermoelectric Properties of Cu-doped Bi2−xSbxTe3 Prepared by Encapsulated Melting and Hot Pressing
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Title
Thermoelectric Properties of Cu-doped Bi2−xSbxTe3 Prepared by Encapsulated Melting and Hot Pressing
Authors
Keywords
Thermoelectric, Bismuth telluride, Copper doping, Encapsulated melting, Hot pressing
Journal
METALS AND MATERIALS INTERNATIONAL
Volume 24, Issue 2, Pages 415-421
Publisher
Springer Nature
Online
2018-02-19
DOI
10.1007/s12540-018-0029-3
References
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