High Thermal Conductivity of Bulk Epoxy Resin by Bottom-Up Parallel-Linking and Strain: A Molecular Dynamics Study

Published 2018 View Full Article

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Title
High Thermal Conductivity of Bulk Epoxy Resin by Bottom-Up Parallel-Linking and Strain: A Molecular Dynamics Study
Authors
Keywords
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Journal
Journal of Physical Chemistry C
Volume 122, Issue 24, Pages 13140-13147
Publisher
American Chemical Society (ACS)
Online
2018-05-31
DOI
10.1021/acs.jpcc.8b02001

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